The widely represented in the market a series of RAM sets Transcend aXeRam is now added with dual channel kit DDR3 of 8 GB with an effective frequency of 2133 and 2400 MHz. Modules are routinely equipped with aluminum radiators with high «scallops» and support overclocking profiles Intel XMP 1.3, actual for the processors Intel Ivy Bridge.
The package Transcend aXeRam DDR3-2133 2x 4 GB consists of two brackets with a combination of delay of memory 10-11-10-27 and moderate voltage 1.6 V. Overclocking enthusiasts will certainly prefer against it more productive Transcend aXeRam DDR3-2400 for the same amount. Timings have been raised in a given set up to 11-12-11-29, and default voltage — up to 1.65 V.
To increase the stability of the new items, they are made on an 8-layer PCB. Overclocking spirit of the tandem Transcend aXeRam DDR3-2133/2400 emphasizes the possibility of fine tuning by the utility aXeMod. In addition, aXeMod monitors the temperature of the memory.
GeIL has lately introduced a new series of memory modules, codenamed Evo Leggera. According to the words of the manufacturers, this series is ready to demonstrate the utmost performance in combination with the low-profile VELOCE radiators which cannot stop the users from installing huge CPU coolers. Evo Leggera represents an optimal solution and improved functionality in one product. The series includes modules of 1333 MHz to 2800 MHz frequencies compiled in two- and four-channel kits.
Evo Leggera is equipped with advanced low-profile heat dispensers 'Leggera' developed with the implementation of Maximum Thermal Conduction and Dissipation technology. This technology ensures efficient cooling activity with the standard module heights. Memory modules Evo Leggera are compatible practically with all newest logics kits, involving Intel Z77 platform. This expands the versatility of the series.
To continue, it should be mentioned that all models in the series have undergone tough …
The motherboard compartment is located above the power supply unit. In this regard, everything is quite standard for a Mid Tower class. A large cutout is made in a tray behind a CPU socket, to allow installation of a CPU cooling system directly into the case; a backplate mount (thrust-pad located on the back side of the motherboard) is used for this purpose.
The four large slots in a tray, equipped with the silicone membrane, are designed for proper cable management which looks very promising here. Plugs of expansion slots are attached by thumbscrews. The front part holds a hard disks’ basket for three drives.
At the back side a slot in a tray can be clearly seen to access cable management system slot. Also, the rear side contains two tool kits for installation of solid-state drives and size 2.5" hard disks.
The side cover is made of 0.7 mm steel, and from the inside has a thick vibration and noise absorbing coating. The recess in the …
Op hierdie bladsy kan jy die lys van vervaardigers Processors bestuurders wat jy kan aflaai op ons webwerf. Vir die beste soek vir'n geskikte bestuurder van 654963 beskikbaar in ons databasis, kies die vervaardiger van jou Processors van 25142 aangebied in hierdie afdeling.
Die verwerker is'n belangrike komponent van REKENAAR hardeware, laptop, mobiele toestelle, virtuele masjiene, netwerk stoor, en programmeerbare logiese beheerder. Hy is verantwoordelik vir die prestasie van die hele stelsel en die verhouding tussen die verskillende komponente in die besonder.
Die doeltreffendheid van die verwerker hang af van die reëls van die produksie tegnologiese proses, mikro-argitektuur, CPU-frekwensie, krag verbruik en prestasie van die rekenaar pitte. Op die doeltreffendheid van die eerste twee parameters te beïnvloed in enige manier waarop dit is onmoontlik, maar om te optimaliseer die prestasie van die res is moontlik as jy die aflaai van die bestuurders vir verwerkers en uit te voer fyn aanpassing van elke funksie.
Vandag, soos baie jare gelede - 'n stryd vir die verbruiker, is daar twee reuse vervaardiger van'n verwerker: Intel en AMD. Hierdie twee maatskappye gereeld vreugde verbruikers van verskillende vlakke (beginner, professionele vlak, entoesiaste, testers) meer kragtige modelle met'n meer indrukwekkende prestasie. Ten spyte van die opkoms van die nuwe tegnologie en die suksesvolle implementering van die nuwe funksies vir die optimale werking van die verwerker is voldoende om die instel van die volgende instellings (dikwels deur middel van'n grafiese koppelvlak, byvoorbeeld, BIOS/UEFIBIOS):
die stelsel bus frekwensie (CPUKlok). Om te overclock die CPU tot'n sekere vlak van prestasie, jy kan outomaties of met die hand instel van die waarde van die klok frekwensie van die stelsel bus;
die kern van die spanning/CPU cores. Die kern spanning wanneer die bedryfstelsel op gegradeer spoed is gewoonlik tussen 1.5-1.75 V. Vir die doeleindes van overclocking, moet die spanning verhoog (beperk – tot 1.85 V);
'n kas geheue. Enige moderne CPU is toegerus met'n hoë-spoed kas geheue. Sy belangrikste taak is om te store dikwels gebruik data en instruksies sonder versuim te verskaf toegang tot hulle. Vir die optimalisering van die werking van die kas geheue antwoord spesifieke bestuurders verwerkers;
energie verbruik. Byna al die nuutste verwerkers is toegerus met energiebesparende meganismes, sowel as beskermende funksies. Die eerste ontwerp is om te verminder die energie verbruik onder verskillende grade van las op die CPU, en die tweede wat ontwerp is om die chip te beskerm teen oorverhitting teen hoër spannings/frekwensies deur die draai af van die eenhede by die maksimum lading of eenvoudig;
bug fixes deur die opdatering van die grafiese dop - die BIOSWerk. Hierdie instelling behels die oordrag van die sagteware microcode van die BIOS - om die CPU in die geval van die opsporing van foute in die CPU. Gewoonlik is die foute bespeur deur die ontwikkelaars self en die doel van hul uitskakeling uitgereik is die opgedateer firmware interface.
The widely represented in the market a series of RAM sets Transcend aXeRam is now added with dual channel kit DDR3 of 8 GB with an effective frequency of 2133 and 2400 MHz. Modules are routinely equipped with aluminum radiators with high «scallops» and support overclocking profiles Intel XMP 1.3, actual for the processors Intel Ivy Bridge.
GeIL has lately introduced a new series of memory modules, codenamed Evo Leggera. According to the words of the manufacturers, this series is ready to demonstrate the utmost performance in combination with the low-profile VELOCE radiators which cannot stop the users from installing huge CPU coolers. Evo Leggera represents an optimal solution and improved functionality in one product. The series includes modules of 1333 MHz to 2800 MHz frequencies compiled in two- and four-channel kits.
Internal structure