AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …

Toughpower Grand series is one of the foreground PSU lines in the production gamma of Thermaltake. The series is replenishing with ever newer models from time to time, offering more advanced facilities and more efficient power. Model Toughpower Grand TPG-700M is one of the latest power supply units from this manufacturer. Its is characterized by the availability of 80Plus Platinum certificate and the employment of high-quality capacitors that ensure its stability of operation. Upon the whole, TPG-700M might be called a worthy follower of Toughpower series.



Specifications and User Experience


Thermaltake Toughpower Grand 700W is notable by a quite wide temperature condition range which fluctuates within the measures of 0 up to 50 degrees. The power on +12VDC rail is estimated at 696W (58A). The correlation of power on this rail with the total power makes up 0.994; this is a sample index for such type of units. All other basic specifications of the model are indicated on the …

Asetek, a well-known manufacturer and supplier of water/liquid cooling solutions, announces the final stage in the development of the 4th generation of its patented liquid-cooling system. Currently, the products developed by Asetek are widely used by OEM-companies in their own systems. However, in accordance with the voiced information, the LCS of the fourth generation will be delivered as OEM-product line, so as a brand Asetek product. The prospective release date is scheduled for the end of 2012.



The 4th generation of patented liquid cooling systems features an elaborated waterblock base and totally refined pump. Such improvement might provide for a dramatic increase in performance. The implemented pump creates a higher pressure and more efficiently distributes the liquid current at the entrance to the micro-channel base structure.


At the same time, thermal resistance has been reduced at 20% which resulted in 1.2 times better waterblock heat irradiation properties. …