Deepcool Industries, a renowned manufacturer of cooling systems, has officially announced the launch of its new dual-tower processor cooler Aeolus Big Frost. The prototype of this model has been already presented at Computex 2012 and is currently released as a ready-made product. This model is compatible with practically all CPU types available in the market from Intel and AMD manufacturers. In addition, it is able to support FM2/FM1 platform.



Deepcool Aeolus Big Frost is a simplified version of Assassin series. Despite this fact, the new cooler preserves the framework standards with dual-section radiators. Aeolus Big Frost has got copper base which is equipped with six U-shaped heat pipes (6 mm each pipe). Those pipes are pierced by a large number of aluminum plates.


The radiators are cooled down by 120 mm fans; the rotation speed of the first fan is able to achieve 1300 rpm, while the speed of the second fan fluctuates between 900 to 1500 rpm. The noise level also …

Corsair company, a recognized developer and provider of PC system components, has just announced about the release of their new product Flash Voyager Slider USB 3.0. This USB-drive has a retractable framework which ensures the socket protection and ease of usage. Flash Voyager Slider USB 3.0 goes in several volume capacities to satisfy the needs of any customer: 8 GB, 16 GB, 32 GB, and 64 GB.



Corsair’s representatives describe Flash Voyager Slider USB 3.0 as the device with high speed performance and proven durability. In order to avoid mere words, the company provides a 5-year guarantee for all drives of this series. It should be mentioned that speed performance of this drive depends on its volume capacity. Thus, the drives of 8 GB and 16 GB capacity are able to develop the speed up to 70 MB/sec in consecutive reading mode, and up to 20 MB/sec in consecutive writing mode. The drives of 32 GB capacity prove to develop the speeds up to 80 MB/sec and 40 MB/sec in consecutive …

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …