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Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.
Intel has just unveiled its new advanced working out: power-saving and high-efficient microarchitecture codenamed Silvermont. According to Intel, this architecture is primarily targeting devices with low power consumption and can embrace a vast production segment, starting from smartphones and finishing with datacenters. Silvermont is ready to demonstrate a threefold increase of performance and fivefold decrease of power consumption (with preservation of erstwhile efficiency), if compared with the current generation of Intel Atom cores. 
Intel Corporation has a rather wide range of motherboards for processors Core i5/i7-3000 (Ivy Bridge), but, nevertheless, continues to produce products based on chipsets 7-Series. According to reports, the release of two motherboards Intel LGA1155 — DZ77GAL-70K is planned soon with code-named Gasper Light and DZ75ML-45K (Middle Lake). The first model uses a set of system logic Z77, second — Z75. Both models will receive a certificate of Windows 8 WHQL, support of Fast Boot technology and Lucid Virtu MVP.